Inspection & Metrology

As the device geometry shrinks, the need for verification of the patterned dimensions as well as detection of killer defects proportionally arises. Furthermore, with the drive toward lower operating wavelengths, the conventional refractive optical design must be replaced with reflective optical systems to enable this technological achievement. The optical and thermal performance requirements of the Wafer Inspection systems (WI) for example, requires a new generation of optical design, source technology, shape accuracy, and specialty thin film coating to provide an effective, robust, and cost effective wafer inspection technology offering for 45 nm device node and beyond.

In this regard, Media Lario Technologies is uniquely positioned to address these demanding requirements leveraging its proprietary electroforming expertise tandem with integrated thermal management know how and highly-specialized thin film coating knowledge. Furthermore, this will allow migration into an enhanced value-add product offering through implementation of its high-precision alignment and integration know how to provide its worldwide customers with reflective optical subsystems.

Media Lario Technologies regards this extension of its core competencies as a synergistic growth potential in semiconductor capital equipment and FPD markets.